Cooler Master CryoNamics heat sink compound Thermal pad 2 g

2.8 g/cm³, 0.07 °C*in²/W, 40 x 30 x 0.2 mm

Key Features

• PHASE CHANGE MATERIAL - A phase change material is implemented to fill in gaps in the product’s construction, thereby improving heat dissipation
• EXTREMELY LOW THERMAL RESISTANCE - A new height of performance has been reached by achieving a hyper-low thermal resistance
• SILICON-FREE - No silicon materials have been used in the manufacturing of our thermal pads
• EASY-TO-APPLY - Our thermal pads have been designed with users in mind, and thus implement a straightforward application method
• HIGH RELIABILITY - A highly reliable structural integrity means our pads wont crack or become misshapen

Description

Introducing Cooler Master’s thermal pads, CRYONAMICS, our latest innovation in cooling technology. Our thermal pads have been optimally designed for a range of applications from CPUs, GPUs, and RAM to modular cooling, TVs, and cars. CRYONAMICS are constructed with a unique phase change material to provide the best possible heat dissipation. With additional features such as being silicon-free, exhibiting extremely low thermal resistance, easy application, and high reliability, CRYONAMICS represents a new high mark to hit for the industry.

PHASE CHANGE MATERIAL
A phase change material is implemented to fill in gaps in the product’s construction, thereby improving heat dissipation. When its reaching to certain degree, the material becomes paste form to moisten the surface so air is being cleared, the thermal resistance is lowered to let the heat out.

SILICON-FREE
No silicon materials have been used in the manufacturing of our thermal pads which is safer for your devices.

EXTREMELY LOW THERMAL RESISTANCE
Comparing to traditional thermal pad, phase change material could fill in the gap much better between the interface, A new height of performance has been reached by achieving a hyper-low thermal resistance

Easy-to-apply
Our thermal pads have been designed with users in mind, and thus implement a straightforward application method. It is recommended to stick on to your cooler’s base and then install it to your CPU or GPU.

Specifications

Features
Type	Thermal pad
Density	2.8 g/cm³
Thermal resistance	0.07 °C/W
Operating temperature (T-T)	-40 - 125 °C
Product colour	Grey
Technical details
Doesn't contain	Silicone
Density	2.8 g/cm³
Thermal resistance	0.07 °C/W
Operating temperature (T-T)	-40 - 125 °C
Weight & dimensions
Width	30 mm
Depth	40 mm
Height	0.2 mm
Weight	2 g
Package width	14 mm
Package depth	87 mm
Package height	117 mm
Package weight	29 g
Packaging data
Package width	14 mm
Package depth	87 mm
Package height	117 mm
Package weight	29 g
Quantity per pack	1 pc(s)
Degreaser included	Yes
Operational conditions
Operating temperature (T-T)	-40 - 125 °C
Colour
Product colour	Grey
Logistics data
Products per master (outer) case	84 pc(s)
Master (outer) case width	255 mm
Master (outer) case length	336 mm
Master (outer) case height	210 mm
Quantity per pack	1 pc(s)