Collection: Heat Sink Compounds
Heat sink compounds are thermal interface materials designed to improve heat transfer between electronic components and heat sinks. They fill microscopic air gaps to enhance thermal conductivity and prevent overheating.
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DeepCool Z3 PRO heat sink compound Thermal paste 4 W/m·K 5.8 g
4W/(m·K), 2.3 g/cm³, -50°C to +220°C, 1.5 g, GrayDescription
DeepCool Z3 PRO delivers high thermal conductivity and reliable insulation with a non-curing, non-corrosive formula—ensuring efficient, long-lasting cooling performance.
Excellent Thermal Conductivity
Z3 PRO rapidly transfers heat away from critical components like CPUs and GPUs, maintaining optimal operating temperatures even under heavy loads.
Pure Electrical Insulation
Z3 PRO is non-conductive, safeguarding your components against electrical damage while maintaining thermal stability.Specifications
Features Type Thermal paste Thermal conductivity 4 W/m·K Operating temperature (T-T) -50 - 220 °C Product colour Grey Specific gravity 2.3 g/cm³ Weight & dimensions Weight 5.8 g Packaging data Package type Blister Quantity per pack 1 pc(s) Technical details Package type Blister Thermal conductivity 4 W/m·K Operating temperature (T-T) -50 - 220 °C Operational conditions Operating temperature (T-T) -50 - 220 °C Colour Product colour Grey Logistics data Quantity per pack 1 pc(s) Regular price $6.00Sale price $6.00 Regular price$9.00 -
DeepCool Z5 PRO heat sink compound Thermal paste 4 W/m·K 7.3 g
4W/(m·K), 2.3 g/cm³, -50°C to +220°C, 3 g, GrayDescription
DeepCool Z5 PRO delivers high thermal conductivity and reliable insulation with a non-curing, non-corrosive formula—ensuring efficient, long-lasting cooling performance.
Excellent Thermal Conductivity
Z5 PRO rapidly transfers heat away from critical components like CPUs and GPUs, maintaining optimal operating temperatures even under heavy loads.
Pure Electrical Insulation
Z5 PRO is non-conductive, safeguarding your components against electrical damage while maintaining thermal stability.Specifications
Features Type Thermal paste Thermal conductivity 4 W/m·K Operating temperature (T-T) -50 - 220 °C Product colour Grey Specific gravity 2.3 g/cm³ Weight & dimensions Weight 7.3 g Packaging data Package type Blister Quantity per pack 1 pc(s) Technical details Package type Blister Thermal conductivity 4 W/m·K Operating temperature (T-T) -50 - 220 °C Operational conditions Operating temperature (T-T) -50 - 220 °C Colour Product colour Grey Logistics data Quantity per pack 1 pc(s) Regular price $7.20Sale price $7.20 Regular price$12.00 -
Corsair XTM70 heat sink compound Thermal paste 3 g
XTM70 Extreme Performance Thermal PasteDescription
EXTREME THERMAL TRANSFER AND COOLING
Premium thermal paste for maximum heat transfer from your high-end processors and components.
UNBEATABLE PERFORMANCE
CORSAIR XTM70 Extreme Performance Thermal Paste delivers higher thermal transfer than competitor products, keeping your high-end CPU, GPU, console, or other components reliably cool.
The proprietary formula that makes up XTM70 is exclusive to CORSAIR. It's perfect for the highest performing, high TDP CPUs and GPUs, where every fraction of a degree matters. Not only that, lower temperatures will reduce your system's cooling requirements, resulting in less fan noise.
EASY APPLICATION AND CLEANING
XTM70 Extreme Performance Thermal Paste includes an applicator kit that makes it easy to apply an even layer onto a cold plate, alongside three included cleaning wipes to handily remove old paste from your hardware.
With 3g of non-electrically conductive paste, XTM70 helps support extreme CPU cooling and lower temperatures without drying or cracking.Specifications
Features Type Thermal paste Weight & dimensions Weight 3 g Packaging data Quantity per pack 1 pc(s) Logistics data Quantity per pack 1 pc(s) Regular price $37.20Sale price $37.20 Regular price$38.50