Collection: Memory Modules

16GB, DDR5, 6000 MT/s, 288-Pin, CL40, 1.4V, Black

Description

Lexar LD5U16G60C400V-RGS DDR5 UDIMM 16GB 6000 MT/s 1.4V CL40 THOR G2 OC HEATSINK BLACK INTEL XMP 3.0 & AMD EXPO

Specifications

Design
Backlight	No
Cooling type	Heatsink
Product colour	Black
Memory
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	16 GB
Internal memory type	DDR5
Component for	PC
ECC	No
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.4 V
Features
On-Die ECC	Yes
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	16 GB
Internal memory type	DDR5
Component for	PC
ECC	No
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 16 GB
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.4 V
Cooling type	Heatsink
Product colour	Black
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	39 mm
Depth	133 mm
Height	7 mm
Weight	66 g

16 GB, DDR4, 3200 MHz, CL16

Reasons To Buy

COMPATIBILITY TESTED

Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t.

XMP 2.0 SUPPORT

One setting is all it takes to automatically adjust to the fastest safe speed for your VENGEANCE LPX kit. You’ll get amazing, reliable performance without lockups or other strange behavior.

DESIGNED FOR HIGH-PERFORMANCE OVERCLOCKING

Each VENGEANCE LPX module is built from an custom performance PCB and highly-screened memory ICs. The efficient heat spreader provides effective cooling to improve overclocking potential.

Description

Vengeance LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom.

The DDR4 form factor is optimized for the latest Intel X99 Series motherboards and offers higher frequencies, greater bandwidth, and lower power consumption than DDR3 modules. Vengeance LPX DDR4 modules are compatibility-tested across X99 Series motherboards for reliably fast performance. There’s XMP 2.0 support for trouble-free automatic overclocking. And, they’re available in multiple colors to match your motherboard, your components, or just your style.

Compatibility tested across X99 Series motherboards for reliably fast performance

Part of our exhaustive testing process includes performance and compatibility testing on most every X99 Series motherboard on the market – and a few that aren’t.

Designed for high-performance overclocking

Each Vengeance LPX module is built from an eight-layer PCB and highly-screened memory ICs. The efficient heat spreader provides effective cooling to improve overclocking potential.

Pure aluminum heat spreader for faster heat dissipation and cooler operation

Overclocking overhead is limited by operating temperature. The unique design of the Vengeance LPX heat spreader optimally pulls heat away from the ICs and into your system’s cooling path, so you can push it harder.

The heat spreader doesn’t just allow Vengeance LPX to run better… the aggressive yet refined form factor looks great in showcase systems.

XMP 2.0 support for trouble-free, automatic overclocking

Manually pushing your DRAM frequency can be a fun experiment, but sometimes you just want to get maximum performance without the hassle.

Intel X99-based motherboards support the new XMP 2.0 standard, and Vengeance LPX DRAM does, too. Turn it on, and it will automatically adjust to the fastest safe speed for your Vengeance LPX kit. You’ll get amazing, reliable performance without lockups or other strange behavior.

Low-profile design fits in smaller spaces

When the first Mini-ITX and Micro ATX motherboards for DDR4 are released, Vengeance LPX will be ready. The small form factor makes it ideal for smaller cases or any system where internal space is at a premium.

Available in multiple colors to match your motherboard or your system

The best high-performance systems look as good as they run. Vengeance LPX is available in several colors to match your motherboard, your other components, your case… or just your favorite color.

Specifications

Design
Backlight	No
Cooling type	Heatsink
Product colour	Black
Memory
Internal memory	16 GB
Internal memory type	DDR4
Memory clock speed	3200 MHz
Component for	PC/Server
ECC	No
Memory layout (modules x size)	2 x 8 GB
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2,1.35 V
Memory channels	Dual-channel
Features
Internal memory	16 GB
Internal memory type	DDR4
Memory clock speed	3200 MHz
Component for	PC/Server
ECC	No
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2,1.35 V
Memory channels	Dual-channel
Country of origin	Taiwan
Cooling type	Heatsink
Product colour	Black
Harmonized System (HS) code	84733020
Technical details
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

32GB (16GBx2), DDR5, 288-pin, 6000 MT/s, RGB

Description

Lexar LD5U16G60C38BV-RGD DDR5 UDIMM 32GB Kit (2 x 16GB) 6000 MT/s 1.35V CL38 THOR G2 OC RGB BLACK INTEL XMP 3.0 & AMD EXPO

Specifications

Design
Backlight colour	RGB
Backlight	Yes
Product colour	Black
Memory
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	32 GB
Internal memory type	DDR5
Component for	PC
ECC	No
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.35 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	32 GB
Internal memory type	DDR5
Component for	PC
ECC	No
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	RGB
Backlight	Yes
Memory layout (modules x size)	2 x 16 GB
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.35 V
Product colour	Black
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	135.4 mm
Depth	45 mm
Height	7.4 mm
Weight	66 g

32GB, DDR5, 5600MT/s, ECC, Registered, DIMM, CL46, x80 2RX8 1.1V, 288-pin, 16Gbit, Hynix A

Description

Kingston memory is designed, manufactured and rigorously tested to meet the exact specifications of each brand name system.

Specifications

Design
JEDEC standard	Yes
Memory
Buffered memory type	Registered (buffered)
Internal memory	32 GB
Internal memory type	DDR5
Component for	PC/Server
ECC	No
Row Precharge Time (TRP)	16
Memory layout (modules x size)	1 x 32 GB
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
Features
On-Die ECC	Yes
Buffered memory type	Registered (buffered)
Internal memory	32 GB
Internal memory type	DDR5
Component for	PC/Server
ECC	No
Row Precharge Time (TRP)	16
Memory layout (modules x size)	1 x 32 GB
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	4096M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
JEDEC standard	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-55 - 100 °C
Technical details
Doesn't contain	Halogen
Compliance certificates	RoHS
Sustainability
Doesn't contain	Halogen
Weight & dimensions
Width	133.3 mm
Height	31.2 mm

96GB, DDR5, 5600MT/s, ECC, Registered, DIMM, CL46, x80, 2RX4, 1.1V, 288-pin, 24Gbit

Description

KINGSTON DRAM, DDR5, ECC Reg, 5600MHz, 96GB Kit (12Gb x 8), CL 46-45-45, 1.1V, Limited Lifetime Warranty

Specifications

Design
Cooling type	Heatsink
JEDEC standard	Yes
Memory
Buffered memory type	Registered (buffered)
Internal memory	96 GB
Internal memory type	DDR5
Component for	PC/Server
ECC	Yes
Row Precharge Time (TRP)	16
Memory layout (modules x size)	1 x 96 GB
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	12288M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Registered (buffered)
Internal memory	96 GB
Internal memory type	DDR5
Component for	PC/Server
ECC	Yes
Row Precharge Time (TRP)	16
Memory layout (modules x size)	1 x 96 GB
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	12288M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Cooling type	Heatsink
Memory ranking	2
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-55 - 100 °C
Technical details
Sustainability compliance	Yes
Doesn't contain	Halogen
Compliance certificates	RoHS
Sustainability
Sustainability compliance	Yes
Doesn't contain	Halogen
Compliance certificates	RoHS
Weight & dimensions
Width	133.3 mm
Height	31.2 mm
Other features
Doesn't contain	Halogen

16GB 5600MT/s DDR5 ECC Reg CL36 DIMM FURY Renegade Pro XMP

Key Features

• Overclocking with ECC
• Increased efficiency
• Intel® XMP 3.0 Certified
• AMD EXPO™ certified
• Sleek aluminum heat spreaders featured on 7200MT/s+ speeds

Description

Overclockable ECC Registered DIMM
Kingston FURY™ Renegade Pro DDR5 RDIMM memory combines gamer-level performance with server-class memory. Next-gen workstations and high-end desktop platforms need DDR5 Registered DIMMs, and Kingston FURY Renegade Pro is there to provide creators, engineers, and data scientists with super-fast memory typically associated with gaming. Certified by Intel XMP® 3.0 or AMD EXPO™, modules are available up to 32GB, with kits of 4 or 8 up to 128GB and 256GB respectively. Available with a graphene label at speeds up to 6400MT/s or an aluminum heat spreader starting at 7200MT/s.

With over three decades of building reliable, high quality memory modules for the world’s largest data centers, Kingston features a line of overclockable server-class memory, Kingston FURY™ Renegade Pro DDR5 RDIMM. To meet the computing demands of next-gen Intel® or AMD workstation and high-end desktop platforms requiring the use of DDR5 Registered DIMMs, Kingston FURY Renegade Pro DDR5 RDIMM provides creators, engineers, and data science professionals with high performance memory normally reserved for gamers, without sacrificing the data integrity features and superior quality grade of Registered DIMMs.

DDR5 Registered DIMMs support ECC, capable of detecting and correcting bit errors. This is in addition to On-Die ECC, featured on all DDR5 DRAM components, which perform single bit error detection and correction to mitigate system lockups and data corruption.

Unleash pro‑grade power with Kingston FURY Renegade Pro DDR5 RDIMM built for maximum speed, rock solid stability, and next level efficiency. Choose your performance mode with precision‑tuned built‑in profiles and build your ideal setup with single modules up to 32GB, kits of 4 up to 128GB, or kits of 8 up to 256GB. Available with a graphene label at speeds up to 6400MT/s or with an aluminum heat spreader starting at 7200MT/s.

Overclocking with ECC
Maintain data integrity while pushing the limits of DDR5 performance.

Increased efficiency
With double the banks and burst lengths, keep up with the demands of the latest programs and applications with improved efficiency and lower latencies.

Intel® XMP 3.0 certified
Select one of the built-in Intel XMP 3.0 profiles in the BIOS to maximize memory performance with advanced pre-optimized timings, speeds, and voltage.

AMD EXPO™ Certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include AMD EXPO and Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice by selecting the corresponding profile in the BIOS.

Sleek aluminum heat spreaders featured on 7200MT/s+ speeds
Maximize cooling with high performance heat spreaders across all modules starting at 7200MT/s and above.

Specifications

Design
Cooling type	Heatsink
Product colour	Black
JEDEC standard	Yes
Memory
Buffered memory type	Registered (buffered)
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	16 GB
Internal memory type	DDR5
Component for	PC/Server
ECC	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Row Precharge Time (TRP)	16
Memory layout (modules x size)	1 x 16 GB
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Registered (buffered)
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	16 GB
Internal memory type	DDR5
Component for	PC/Server
ECC	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Row Precharge Time (TRP)	16
Memory layout (modules x size)	1 x 16 GB
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	2048M x 80
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Product colour	Black
Memory ranking	1
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-55 - 100 °C
Technical details
Doesn't contain	Halogen
Compliance certificates	RoHS
Sustainability
Doesn't contain	Halogen
Compliance certificates	RoHS
Weight & dimensions
Width	3.8 mm
Depth	133.3 mm
Height	31.2 mm
Weight	18.2 g
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	34.72 g
Packaging data
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	34.72 g
Logistics data
Master (outer) case width	196.8 mm
Master (outer) case length	311.1 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.15 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan
Doesn't contain	Halogen

32 GB Kit (2x 16 GB), DDR5 288-pin, 6000 MT/s, Intel XMP 3.0 / AMD EXPO

Description

Lexar LD5U16G60C380V-RGD DDR5 UDIMM 32GB Kit (2 x 16GB) 6000 MT/s 1.35V CL38 THOR G2 HEATSINK BLACK INTEL XMP 3.0 & AMD EXPO

Capacity
32GB (2x16GB)
Performance
6000MT/s | 5600MT/s¹
Interface
288-Pin UDIMM
Operating Temperature
0°C to 85°C (Surface)
Storage Temperature
-55°C to 100°C
Dimension (L x W x H)
138.3 x 40.8 x 7.6 mm (with heat spreader)
Warranty
Lifetime limited warranty
Memory Type
DDR5
Standard
Intel XMP 3.0 & AMD EXPO™
CAS Latency
5600:CL36-36-36-76
6000:CL32-38-38-762
Voltage
5600:1.25V
6000:1.35V2
Application
PC Enthusiasts and Business Applications
CAS Latency
6000MT/s: CL32-38-38-76
6000MT/s: CL38-48-48-96
5600MT/s: CL36-36-36-76
Warranty
Limited lifetime warranty

Specifications

Design
Cooling type	Heatsink
Product colour	Black
Memory
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	32 GB
Internal memory type	DDR5
Component for	PC
ECC	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35,1.4 V
Memory channels	Dual-channel
Features
On-Die ECC	Yes
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	32 GB
Internal memory type	DDR5
Component for	PC
ECC	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35,1.4 V
Memory channels	Dual-channel
Cooling type	Heatsink
Product colour	Black
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	133 mm
Depth	7 mm
Height	39 mm
Weight	66 g

DDR5, 8GB(1 x 8GB), 5600MHz, CL40, 44800 MB/s

Key Features

• Faster than ever with 4800MHz frequency
• New structural composition for better performance
• Conserve energy with energy-efficient 1.1V working voltage
• Supports on-die ECC for more stable systems
• Upgraded capacity for powerful multitasking

Description

The TEAMGROUP ELITE SO-DIMM DDR5 is equipped with an ultra-high frequency of 4800MHz, 32 banks comprised from 8 bank groups, PMIC chip, and on-die ECC. For system stability and energy efficiency, TEAMGROUP has reduced the working voltage to 1.1V to offer the system better performance and more reliable computations for an incredible laptop experience

Specifications

Memory
Buffered memory type	Unregistered (unbuffered)
Internal memory	8 GB
Internal memory type	DDR5
Memory clock speed	5600 MHz
Component for	Laptop
ECC	No
Memory layout (modules x size)	1 x 8 GB
Memory form factor	262-pin SO-DIMM
CAS latency	46
Features
Buffered memory type	Unregistered (unbuffered)
Internal memory	8 GB
Internal memory type	DDR5
Memory clock speed	5600 MHz
Component for	Laptop
ECC	No
Memory layout (modules x size)	1 x 8 GB
Memory form factor	262-pin SO-DIMM
CAS latency	46
Memory data transfer rate	44800 MT/s
Weight & dimensions
Width	70 mm
Depth	7 mm
Height	30 mm