Cooler Master Hyper 212 3DHP Black Processor Air cooler 12 cm 1 pc(s)
Cooler Master Hyper 212 3DHP Black Processor Air cooler 12 cm 1 pc(s)
SKU: MAY-T2HP-217PK-R1
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$48.03
Price:
$48.03
Regular price
$51.70
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120 mm, Intel/AMD, 0 - 2050 RPM, 107.2 m³/h, 2.69 mmH2O, 4-Pin PWM, 12 VDC
The Cooler Master Hyper 212 has long been the reliable choice for solid, no-fuss cooling, trusted by professionals around the world. The new Hyper 212 3DHP Black takes that reputation even further. Its proprietary 3DHP Technology transfers heat away from the CPU more efficiently, rivaling the performance of conventional four-heat-pipe coolers. Using just two heat pipes, it’s engineered to maintain optimal processor temperatures under heavy workloads.
Designed for every PC builder, the Hyper 212 3DHP Black delivers reliable cooling with stylish flair. Built for easy installation and consistent performance, it’s your ideal starting point for cool, quiet computing.
Less heat pipes. More cooling efficiency.
Less noise. More reliability.
Cooler Master Proprietary 3DHP Technology
3DHP technology redefines heat pipe design by adding a third dimension—an extra pipe that fills the dead zone in standard U-shaped layouts. This added connection improves heat transfer in a slimmer, more efficient design.
It delivers the cooling power of a four-pipe solution with a more streamlined layout—giving you lower temps, quieter fans, and more flexibility, whether you’re building for silence or pushing your system to the limit.
Quieter. Stronger. Smarter.
Fewer pipes, better performance. 3DHP’s efficient heat transfer reduces radiator turbulence and lowers fan noise across the system. Whether you’re building for silence or tuning for peak output, 3DHP delivers.
The Advanced 3DHP Internal Structure
3DHP heat pipes use a hybrid internal structure that combines sintered powder and grooved channels in varying textures and sizes. Each section is optimized for a specific phase—evaporation, condensation, or liquid return—resulting in more efficient heat transfer than traditional designs.
Pre-Installed Ring Blade Fan
The included Mobius 120 fan features a ring blade design that cuts high-frequency noise and keeps operation smooth and quiet—especially when paired with the 3DHP module.
Excellent Thermal Dissipation
Keeps temperatures lower under the same CPU workload, helping maintain system stability and long-term reliability.
Pre-Installed Ring Blade Fan
The included Mobius 120 fan features a ring blade design that cuts high-frequency noise and keeps operation smooth and quiet—especially when paired with the 3DHP module.
Larger Contact Surface for Maximum Heat Transfer
Unlike most four-pipe coolers with direct contact, our solid copper base covers more surface area. Combined with wider 3DHP heat pipes, it ensures efficient heat transfer from the CPU to the cooling array.
Sleek, Modern Design
Finished in matte black with clean lines and subtle contours, Hyper 212 3DHP Black integrates seamlessly into modern setups.
CRYOFUZE THERMAL PASTE
Included high-performance thermal paste relies on nanoparticles for maximal heat transfer.
CRYOFUZE THERMAL PASTE
AMD & INTEL COMPATIBILITY
Features compatibility with AMD and Intel CPU sockets.
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Key Features
- Cooler Master Proprietary 3DHP technology
- Superior thermal performance
- Pre-installed ring blade fan
- Larger contact surface area
Description
A Legendary Cooler, EvolvedThe Cooler Master Hyper 212 has long been the reliable choice for solid, no-fuss cooling, trusted by professionals around the world. The new Hyper 212 3DHP Black takes that reputation even further. Its proprietary 3DHP Technology transfers heat away from the CPU more efficiently, rivaling the performance of conventional four-heat-pipe coolers. Using just two heat pipes, it’s engineered to maintain optimal processor temperatures under heavy workloads.
Designed for every PC builder, the Hyper 212 3DHP Black delivers reliable cooling with stylish flair. Built for easy installation and consistent performance, it’s your ideal starting point for cool, quiet computing.
Less heat pipes. More cooling efficiency.
Less noise. More reliability.
Cooler Master Proprietary 3DHP Technology
3DHP technology redefines heat pipe design by adding a third dimension—an extra pipe that fills the dead zone in standard U-shaped layouts. This added connection improves heat transfer in a slimmer, more efficient design.
It delivers the cooling power of a four-pipe solution with a more streamlined layout—giving you lower temps, quieter fans, and more flexibility, whether you’re building for silence or pushing your system to the limit.
Quieter. Stronger. Smarter.
Fewer pipes, better performance. 3DHP’s efficient heat transfer reduces radiator turbulence and lowers fan noise across the system. Whether you’re building for silence or tuning for peak output, 3DHP delivers.
The Advanced 3DHP Internal Structure
3DHP heat pipes use a hybrid internal structure that combines sintered powder and grooved channels in varying textures and sizes. Each section is optimized for a specific phase—evaporation, condensation, or liquid return—resulting in more efficient heat transfer than traditional designs.
Pre-Installed Ring Blade Fan
The included Mobius 120 fan features a ring blade design that cuts high-frequency noise and keeps operation smooth and quiet—especially when paired with the 3DHP module.
Excellent Thermal Dissipation
Keeps temperatures lower under the same CPU workload, helping maintain system stability and long-term reliability.
Pre-Installed Ring Blade Fan
The included Mobius 120 fan features a ring blade design that cuts high-frequency noise and keeps operation smooth and quiet—especially when paired with the 3DHP module.
Larger Contact Surface for Maximum Heat Transfer
Unlike most four-pipe coolers with direct contact, our solid copper base covers more surface area. Combined with wider 3DHP heat pipes, it ensures efficient heat transfer from the CPU to the cooling array.
Sleek, Modern Design
Finished in matte black with clean lines and subtle contours, Hyper 212 3DHP Black integrates seamlessly into modern setups.
CRYOFUZE THERMAL PASTE
Included high-performance thermal paste relies on nanoparticles for maximal heat transfer.
CRYOFUZE THERMAL PASTE
AMD & INTEL COMPATIBILITY
Features compatibility with AMD and Intel CPU sockets.
Specifications
| Performance | |
|---|---|
| Suitable location | Processor |
| Fan connector | 4-pin |
| Pulse-width modulation (PWM) support | Yes |
| Type | Air cooler |
| Rotational speed (min) | 0 RPM |
| Rotational speed (max) | 2050 RPM |
| Fins material | Aluminium |
| Bearing type | Loop Dynamic Bearing (LDB) |
| Fan diameter | 12 cm |
| Supported processor sockets | LGA 1700, LGA 1200 (Socket H5), LGA 1151 (Socket H4), LGA 1150 (Socket H3), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1851, Socket AM4, Socket AM5 |
| Maximum air pressure | 2.69 mmH2O |
| Airflow | 107.2 m³/h |
| Quantity per pack | 1 pc(s) |
| Fan noise level (max) | 22.6 dB |
| Fan's mean time to failure (MTTF) | 200000 h |
| Design | |
| Fan connector | 4-pin |
| Fins material | Aluminium |
| Product colour | Black |
| Illumination LED | No |
| Ports & interfaces | |
| Fan connector | 4-pin |
| Power | |
| Safety current | 0.35 Ah |
| Rated voltage | 12 V |
| Rated current | 0.12 A |
| Power consumption (typical) | 1.44 W |
| Weight & dimensions | |
| Width | 86 mm |
| Depth | 133 mm |
| Height | 158 mm |
| Fan dimensions (W x D x H) | 120 x 120 x 25 mm |
| Package width | 116 mm |
| Package depth | 156 mm |
| Package height | 220 mm |
| Technical details | |
| Fan connector | 4-pin |
| Illumination LED | No |
| Other features | |
| Safety current | 0.35 Ah |
| Logistics data | |
| Master (outer) case width | 325 mm |
| Master (outer) case length | 485 mm |
| Master (outer) case height | 245 mm |
